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Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
PS21965-4, PS21965-4A, PS21965-4C
Intellimod? Module
Dual-In-Line Intelligent Power Module
20 Amperes/600 Volts
Absolute Maximum Ratings, T j = 25°C unless otherwise specified
PS21965-4, PS21965-4A
Characteristics
Power Device Junction Temperature*
Storage Temperature
Case Operating Temperature (Note 1)
Mounting Torque, M3 Mounting Screws
Module Weight (Typical)
Heatsink Flatness (Note 2)
Self-protection Supply Voltage Limit (Short Circuit Protection Capability)**
Isolation Voltage, AC 1 minute, 60Hz Sinusoidal, Connection Pins to Heatsink Plate
Symbol
T j
T stg
T C
—
—
—
V CC(prot.)
V ISO
PS21965-4C
-20 to 150
-40 to 125
-20 to 100
6.9
10
-50 to 100
400
1500
Units
°C
°C
°C
in-lb
Grams
μm
Volts
Volts
*The ma ximum junction temperature rating of the power chips integrated within the DIP-IPM is 150°C (@T C ≤ 100°C). However, to ensure safe operation of the DIP-IPM,
the average junction temperature should be limited to T j(avg) ≤ 125°C (@T C ≤ 100°C).
**V D = 13.5 ~ 16.5V, Inverter Part, T j = 125°C, Non-repetitive, Less than 2μs
IGBT Inverter Sector
Collector-Emitter Voltage
Each Collector Current, ± (T C = 25°C)
Each Peak Collector Current, ± (T C = 25°C, Less than 1ms)
Supply Voltage (Applied between P - N)
Supply Voltage, Surge (Applied between P - N)
Collector Dissipation (T C = 25°C, per 1 Chip)
V CES
I C
I CP
V CC
V CC(surge)
P C
600
20
40
450
500
35.7
Volts
Amperes
Amperes
Volts
Volts
Watts
Control Sector
Supply Voltage (Applied between V P1 -V NC , V N1 -V NC )
Supply Voltage (Applied between V UFB -U, V VFB -V, V WFB -W)
Input Voltage (Applied between U P , V P , W P -V NC , U N , V N , W N -V NC )
Fault Output Supply Voltage (Applied between F O -V NC )
Fault Output Current (Sink Current at F O Terminal)
Current Sensing Input Voltage (Applied between C IN -V NC )
V D
V DB
V IN
V FO
I FO
V SC
20
20
-0.5 ~ V D +0.5
-0.5 ~ V D +0.5
1
-0.5 ~ V D +0.5
Volts
Volts
Volts
Volts
mA
Volts
Note 1 – T C Measure Point
CONTROL TERMINALS
DIP-IPM
Note 2 – Flatness Measurement Position
MEASUREMENT POINT
IGBT
CHIP
FWDi
CHIP
11.6mm
3.0mm
TC POINT
HEATSINK SIDE
+ –
HEATSINK
4.6mm
PLACE TO CONTACT
A HEATSINK
2
POWER TERMINALS
–
+
HEATSINK
Rev. 12/09
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相关代理商/技术参数
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